A few days ago, reports have surfaced that 15 million units of the next iPhones were placed by Apple from Taiwan-based manufacturer Pegatron. Now, financial news company Wall Street Journal has learned a bit more information about the upcoming smartphone. It reported that the new iPhone will be thinner and lighter than the iPhone 4.
According to its sources, the new iPhone is expected to be lighter and thinner than its predecessor and will sport an 8-megapixel camera, an improvement from iPhone 4’s 5-megapixel lens. Other reports say that the camera may be supplied by Sony. The new iPhone will also scrap memory chips by Samsung Electronics Co. and baseband chips from Infineon Technologies, and will operate on Qualcomm Inc.’s wireless baseband chips. Officials from Samsung and Infineon declined to comment.
It was also reported that Apple is preparing to produce 25 million new iPhone units by the end of the year.
“Apple’s sales estimates of the new iPhone is quite aggressive. It told us to prepare to help the company meet its goal of 25 million units by the end of the year,” a source from one of the suppliers said. “The initial production volume will be a few million units… we were told to ship the components to assembler Hon Hai in August.”
The 25 million iPhone units ordered by Apple may be too much for Foxconn (Hon hai) to handle. According to WSJ: “Two of the people [from Hon Hai], however, cautioned that shipments of the new iPhone could be delayed if Hon Hai can’t improve its yield rate as the new iPhone is ‘complicated and difficult to assemble.'”